Inseto (UK) Ltd

Company Relationships

• We distribute for Nordson (UK) Ltd
• Techworks (UK) Ltd are our trade association member
• Alcumus Isoqar Ltd are our trade association member

Brand & Trade Names

• Advanced Dicing Technologies - A.D.T. Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Equipment Division, ADT is a world leader in the development and manufacture of dicing saws, laser scribing systems & blades used in the dicing of Silicon-based Semiconductor Wafers and hard materials including Glass, Ceramics, Ferrites, MEMS and in Package Singulation.
• Advanced Integrated Technologies (AIT) Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Materials Division, AIT manufacturer of catalogue and custom resistance welding electrodes and hot bar soldering thermodes, in a comprehensive range of materials for all makes and models of equipment (equivalent tables available).
• Amadyne Exclusively represented in the UK, Ireland by Inseto, Amadyne manufacture flexible microelectronic pick & place systems, die bonding equipment and die sorting machines in manual-inline configurations. Automation systems for Microelectronics assembly processes including pick & place, dispensing, UV & snap curing, eutectic soldering, flip chip etc.
• Applied Thin Film Products - ATP Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Materials Division, ATP fabricates thin film circuits on substrates from As-Fired Alumina to Beryllium to Fused Silica & Silicon, with metalisation including Tan/TiW/Au to films including Ni, Pd & Ti. with a quick turn-around according to customers specific requirements.
• ATV Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Equipment Division, ATV manufacture a range of equipment for various thermal processes, including rapid ramping furnaces, vacuum solder reflow equipment, LTCC sintering presses, atomic layer deposition equipment, as well as diamond scribing systems for wafers and other devices.
• Coining-Amatek Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Materials Division, Coining manufacturers of gold and aluminium ultrasonic bonding wire / ribbon, plated wire and ribbons for welding, solder preforms, clad metal parts and precision metal stampings.
• DELO Industrial Adhesives GmbH Exclusively representing DELO Industrial Adhesives, Inseto's adhesive division has the technical expertise to advise on all your project requirements. DELO manufactures a comprehensive range of UV cured or light activated Epoxies, light cured Acrylates, light / heat cured Epoxies, light / Anaerobic curing Anaerobics, 2 part Polyurethanes, 1 & 2 part Epoxies, Cyanoacrylates and single part Silicones. Inseto can also offer tailor-made adhesive solutions that meet your technical bonding requirements.
• Egide Egide is a European-based manufacturer of leading-edge high reliability hermetic packages in HTCC Ceramic or Glass Feedthroughs, housings and enclosures. Founded in France in 1986, Egide has evolved to become a marquee name in the world of hermetic packages for critical applications.
• Egide-Santier Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Materials Division, Egide-Santier manufacturer of high thermal conductivity metals and of seal frames for hermetic packaging, including copper tungsten, silvar, copper moly, and metal-matrix heat sinks.
• IDB Technologies Supplier of Semiconductor Wafers, including Silicon, Oxide, Nitride, Silica, Sapphire from 1" to 300mm from stock to customers worldwide.
• Koartan Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Materials Division, Koartan manufactures thick film polymer inks, pastes & glazes, including silver based and gold based conductors, dielectrics, resistors, thermistors & capacitor materials, plug pastes & etchable conductors.
• Kulicke and Soffa Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Equipment Division, Kulicke and Soffa (K&S) automatic gold ball and bump bonders, Orthodyne wedge bonders and automatic die bonding equipment.
• MPP Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto, MPP manufacture manuals wire bonders and high quality wire bonding tools including wedges, die collets and pickup tools etc. custom and OEM equivalents for all makes of bonding equipment.
• Nordson-DAGE Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Equipment Division, Dage manufacture wire bond testing equipment for wire pull test, bond shear, bump shear and die shear, stud pull, fine pitch shear testing etc.
• Plasma Etch Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Equipment Division, Plasma Etch are leading manufacturers of Plasma treatment, ashing, etching and cleaning systems, including entry level benchtop models through industrial to high volume continuous feed production equipment.
• SemiProbe Exclusively represented in the UK, Ireland, Denmark, Finland, Norway and Sweden by Inseto's Microelectronic Equipment Division, SemiProbe is a global supplier of manual to automatic wafer probing and testing solutions for semiconductor, microelectronics, MEMS, nanotechnology, chemistry, microfluidics, optoelectronics, photovoltaics and more used throughout Universities, Research and Production facilities.
• SUSS MicroTec Lithography equipment including Mask Aligners, Spin and Spray Coaters, Developing Systems, Hot Plates and Wafer Aligning and Bonding Equipment.

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Products & Services