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We offer a total solution manufacturing package which includes the following contract manufacturing services: Chip-on-board (COB) wire bonding, Surface-mount-technology (SMT) PCB assembly, Ball-grid-array (BGA and micro BGA), Through-hole (TH) PCB assembly, Pb free and Rohs compliance process, Plastic injection molding, Sheet metal stamping, CNC Turret press punching, Welding, Die casting, Silk-screening, pad-printing, painting and powder coating, Functional testing, ICT testing, burn-in testing, automatic optical inspection (AOI) to chip programming, Mac address programming, serializing and labeling to completed box built.
New product introduction process (NPI), Low volume high mix, High volume low mix, Complete box build.
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http://www.gateway-electronics.com
